LC

Lai Yee Chia

SC Stats Chippac: 2 patents #25 of 128Top 20%
📍 Singapore, SG: #168 of 1,548 inventorsTop 15%
Overall (2017): #130,772 of 506,227Top 30%
2
Patents 2017

Issued Patents 2017

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
9824923 Semiconductor device and method of forming conductive pillar having an expanded base Dzafir Bin Mohd Shariff, Kwong Loon Yam, Yung Kuan Hsiao 2017-11-21
9768066 Semiconductor device and method of forming conductive vias by direct via reveal with organic passivation Xing Zhao, Duk Ju Na 2017-09-19