Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9768066 | Semiconductor device and method of forming conductive vias by direct via reveal with organic passivation | Xing Zhao, Lai Yee Chia | 2017-09-19 |
| 9728415 | Semiconductor device and method of wafer thinning involving edge trimming and CMP | Vinoth Kanna Chockanathan, Xing Zhao, Chang Bum Yong | 2017-08-08 |