Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837336 | Semiconductor device and method of forming insulating layer in notches around conductive TSV for stress relief | Won Kyoung Choi, Jae Hun Ku | 2017-12-05 |
| 9728415 | Semiconductor device and method of wafer thinning involving edge trimming and CMP | Vinoth Kanna Chockanathan, Xing Zhao, Duk Ju Na | 2017-08-08 |