Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9728415 | Semiconductor device and method of wafer thinning involving edge trimming and CMP | Xing Zhao, Duk Ju Na, Chang Bum Yong | 2017-08-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9728415 | Semiconductor device and method of wafer thinning involving edge trimming and CMP | Xing Zhao, Duk Ju Na, Chang Bum Yong | 2017-08-08 |