BH

Byung Joon Han

SC Stats Chippac: 6 patents #10 of 128Top 8%
📍 Singapore, NJ: #1 of 10 inventorsTop 10%
Overall (2017): #22,913 of 506,227Top 5%
6
Patents 2017

Issued Patents 2017

Showing 1–6 of 6 patents

Patent #TitleCo-InventorsDate
9754897 Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits Yaojian Lin, Rajendra D. Pendse, Il Kwon Shim, Pandi C. Marimuthu, Won Kyoung Choi +1 more 2017-09-05
9721862 Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages Il Kwon Shim, Yaojian Lin, Pandi C. Marimuthu 2017-08-01
9704824 Semiconductor device and method of forming embedded wafer level chip scale packages Yaojian Lin, Pandi C. Marimuthu, Il Kwon Shim 2017-07-11
9564413 Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus Il Kwon Shim, Heap Hoe Kuan 2017-02-07
9559004 Semiconductor device and method of singulating thin semiconductor wafer on carrier along modified region within non-active region formed by irradiating energy Il Kwon Shim, Won Kyoung Choi 2017-01-31
9553162 Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus Thomas Strothmann, Steve Anderson, Il Kwon Shim, Heap Hoe Kuan 2017-01-24