Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847253 | Package-on-package using through-hole via die on saw streets | Byung Tai Do, Seng Guan Chow | 2017-12-19 |
| 9564413 | Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus | Byung Joon Han, Il Kwon Shim | 2017-02-07 |
| 9553162 | Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus | Thomas Strothmann, Steve Anderson, Byung Joon Han, Il Kwon Shim | 2017-01-24 |