Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9704769 | Semiconductor device and method of forming encapsulated wafer level chip scale package (EWLCSP) | Seung Wook Yoon, Yaojian Lin | 2017-07-11 |
| 9620413 | Semiconductor device and method of using a standardized carrier in semiconductor packaging | Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon +1 more | 2017-04-11 |
| 9553162 | Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus | Steve Anderson, Byung Joon Han, Il Kwon Shim, Heap Hoe Kuan | 2017-01-24 |