Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9721921 | Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form | KyungMoon Kim, KooHong Lee, JaeHak Yee, YoungChul Kim, Lan H. Hoang +3 more | 2017-08-01 |
| 9553162 | Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus | Thomas Strothmann, Byung Joon Han, Il Kwon Shim, Heap Hoe Kuan | 2017-01-24 |