Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9721921 | Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form | KooHong Lee, JaeHak Yee, YoungChul Kim, Lan H. Hoang, Pandi C. Marimuthu +3 more | 2017-08-01 |