Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842775 | Semiconductor device and method of forming a thin wafer without a carrier | Pandi C. Marimuthu, Shuangwu Huang | 2017-12-12 |
| 9741619 | Methods for singulating semiconductor wafer | William John Nelson, Beng Yeung Ho, Poh Leng Wilson Ong | 2017-08-22 |
| 9613877 | Semiconductor packages and methods for forming semiconductor package | John Ducyao Beleran, Serafin P. Pedron, Jr. | 2017-04-04 |
| 9589875 | Semiconductor packages and methods of packaging semiconductor devices | Chuen Khiang Wang, Kriangsak Sae Le, Antonio Jr B Dimaano, Catherine Bee Liang Ng, Richard Te Gan +1 more | 2017-03-07 |
| 9583446 | Semiconductor device and method of forming a shielding layer between stacked semiconductor die | Reza A. Pagaila, Byung Tai Do | 2017-02-28 |
| 9570314 | Methods for singulating semiconductor wafer | William John Nelson, Beng Yeung Ho, Poh Leng Wilson Ong | 2017-02-14 |