Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754867 | Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package | Yaojian Lin, Kang Chen, Xia Feng | 2017-09-05 |
| 9679863 | Semiconductor device and method of forming interconnect substrate for FO-WLCSP | Yaojian Lin, Xia Feng, Kang Chen | 2017-06-13 |
| 9666500 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Hin Hwa Goh, Yu Gu +4 more | 2017-05-30 |
| 9601434 | Semiconductor device and method of forming openings through insulating layer over encapsulant for enhanced adhesion of interconnect structure | Yaojian Lin, Kang Chen | 2017-03-21 |
| 9558958 | Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation | Yaojian Lin, Kang Chen, Xia Feng | 2017-01-31 |
| 9548240 | Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package | Yaojian Lin, Kang Chen, Xia Feng | 2017-01-17 |