| 9813043 |
Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods |
Chengjie Zuo, Daeik Daniel Kim, Je-Hsiung Lan, Jonghae Kim, Mario Francisco Velez +5 more |
2017-11-07 |
| 9793164 |
Self-aligned metal cut and via for back-end-of-line (BEOL) processes for semiconductor integrated circuit (IC) fabrication, and related processes and devices |
Vladimir Machkaoutsan, Stanley Seungchul Song, John Jianhong Zhu, Junjing Bao, Jeffrey Junhao Xu +2 more |
2017-10-17 |
| 9768109 |
Integrated circuits (ICS) on a glass substrate |
Shiqun Gu, Daeik Daniel Kim, Jonghae Kim, Changhan Hobie Yun, Je-Hsiung Lan +1 more |
2017-09-19 |
| 9672885 |
MRAM word line power control scheme |
Sungryul Kim, Jung Pill Kim, Taehyun Kim, Seung H. Kang, Manoj Bhatnagar |
2017-06-06 |
| 9673275 |
Isolated complementary metal-oxide semiconductor (CMOS) devices for radio-frequency (RF) circuits |
Daeik Daniel Kim, Changhan Hobie Yun, Je-Hsiung Lan, Niranjan Sunil Mudakatte, Jonghae Kim |
2017-06-06 |
| 9660110 |
Varactor device with backside contact |
Daeik Daniel Kim, Jonghae Kim, Chengjie Zuo, Sang-June Park, Changhan Hobie Yun +3 more |
2017-05-23 |
| 9634640 |
Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods |
Chengjie Zuo, Daeik Daniel Kim, Je-Hsiung Lan, Jonghae Kim, Mario Francisco Velez +5 more |
2017-04-25 |
| 9620463 |
Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP) |
Daeik Daniel Kim, David Francis Berdy, Mario Francisco Velez, Changhan Hobie Yun, Chengjie Zuo +1 more |
2017-04-11 |
| 9572532 |
Button sensor |
Barry Matsumori, Kenneth Kaskoun, Nicholas Yu |
2017-02-21 |