Issued Patents 2017
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842832 | High density interconnection of microelectronic devices | Omkar G. Karhade, John S. Guzek, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande +6 more | 2017-12-12 |
| 9820384 | Flexible electronic assembly method | Sasha N. Oster, Robert L. Sankman, Charles A. Gealer, Omkar G. Karhade, John S. Guzek +8 more | 2017-11-14 |
| 9806011 | Non-uniform substrate stackup | Zhichao Zhang, Tao Wu, Zhiguo Qian | 2017-10-31 |
| 9807866 | Shielding mold for electric and magnetic EMI mitigation | Zhichao Zhang, Adel A. Elsherbini, Robert L. Sankman | 2017-10-31 |
| 9780510 | Socket contact techniques and configurations | Dhanya Athreya, Gaurav Chawla, Glen P. Gordon, Sarah M. Canny, Jeffory L. Smalley +3 more | 2017-10-03 |
| 9622339 | Routing design for high speed input/output links | Zhiguo Qian | 2017-04-11 |
| 9564407 | Crosstalk polarity reversal and cancellation through substrate material | Zhichao Zhang, Tolga Memioglu, Tao Wu | 2017-02-07 |
| 9542522 | Interconnect routing configurations and associated techniques | Zhiguo Qian, Dae-Woo Kim | 2017-01-10 |