Issued Patents 2017
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847284 | Stacked wafer DDR package | — | 2017-12-19 |
| 9748227 | Dual-sided silicon integrated passive devices | Vidhya Ramachandran, Kunzhong Hu, Mengzhi Pang, Chonghua Zhong | 2017-08-29 |
| 9728481 | System with a high power chip and a low power chip having low interconnect parasitics | Abraham Yee, Joe Greco, Joseph Minacapelli, John Chen | 2017-08-08 |
| 9691701 | SOC with integrated voltage regulator using preformed MIM capacitor wafer | Kunzhong Hu | 2017-06-27 |
| 9679187 | Finger biometric sensor assembly including direct bonding interface and related methods | Milind S. Bhagavat, Patrick E. O'Brien, Dale R. Setlak, David D. Coons, Kwan-Yu Lai | 2017-06-13 |
| 9679801 | Dual molded stack TSV package | Kwan-Yu Lai, Kunzhong Hu, Flynn Carson | 2017-06-13 |
| 9659907 | Double side mounting memory integration in thin low warpage fanout package | Kunzhong Hu, Chonghua Zhong, Mengzhi Pang, Se Young Yang | 2017-05-23 |
| 9661411 | Integrated MEMS microphone and vibration sensor | Caleb C. Han, Tongbi Jiang | 2017-05-23 |
| 9633974 | System in package fan out stacking architecture and process flow | Kunzhong Hu, Kwan-Yu Lai, Mengzhi Pang, Chonghua Zhong, Se Young Yang | 2017-04-25 |
| 9624093 | Method and apparatus of making MEMS packages | Tongbi Jiang | 2017-04-18 |
| 9601471 | Three layer stack structure | Kunzhong Hu | 2017-03-21 |
| 9595526 | Multi-die fine grain integrated voltage regulation | Jared L. Zerbe, Emerson S. Fang, Shawn Searles | 2017-03-14 |
| 9595514 | Package with SoC and integrated memory | John Bruno, Timothy J. Millet | 2017-03-14 |
| 9589936 | 3D integration of fanout wafer level packages | Kunzhong Hu, Flynn Carson | 2017-03-07 |
| 9583472 | Fan out system in package and method for forming the same | Chih-Ming Chung, Yizhang Yang | 2017-02-28 |
| 9574959 | Various stress free sensor packages using wafer level supporting die and air gap technique | Caleb C. Han, Tongbi Jiang | 2017-02-21 |
| 9570367 | Ultra fine pitch PoP coreless package | Jun Chung Hsu | 2017-02-14 |
| 9559081 | Independent 3D stacking | Kwan-Yu Lai, Kunzhong Hu | 2017-01-31 |
| 9548288 | Integrated circuit die decoupling system with reduced inductance | Vidhya Ramachandran, Chonghua Zhong, Shawn Searles, Young Doo Jeon, Huabo Chen | 2017-01-17 |