| 9837309 |
Semiconductor via structure with lower electrical resistance |
Lawrence A. Clevenger, Kirk D. Peterson, Terry A. Spooner, Junli Wang |
2017-12-05 |
| 9791502 |
On-chip usable life depletion meter and associated method |
Jeanne P. Bickford, Nazmul Habib, Tad J. Wilder |
2017-10-17 |
| 9768116 |
Optimized wires for resistance or electromigration |
Lawrence A. Clevenger, Kirk D. Peterson |
2017-09-19 |
| 9761526 |
Interconnect structure having tungsten contact copper wiring |
Anthony K. Stamper |
2017-09-12 |
| 9761482 |
Enhancement of iso-via reliability |
Lawrence A. Clevenger, Xiao Hu Liu, Kirk D. Peterson |
2017-09-12 |
| 9759766 |
Electromigration test structure for Cu barrier integrity and blech effect evaluations |
Griselda Bonilla, Elbert E. Huang, Chao-Kun Hu, Paul S. McLaughlin |
2017-09-12 |
| 9711452 |
Optimized wires for resistance or electromigration |
Lawrence A. Clevenger, Kirk D. Peterson |
2017-07-18 |
| 9685407 |
Optimized wires for resistance or electromigration |
Lawrence A. Clevenger, Kirk D. Peterson |
2017-06-20 |
| 9659817 |
Structure and process for W contacts |
Daniel C. Edelstein, Chih-Chao Yang |
2017-05-23 |
| 9653403 |
Structure and process for W contacts |
Daniel C. Edelstein, Chih-Chao Yang |
2017-05-16 |
| 9639645 |
Integrated circuit chip reliability using reliability-optimized failure mechanism targeting |
Jeanne P. Bickford, Nazmul Habib, Tad J. Wilder |
2017-05-02 |
| 9625325 |
System and method for identifying operating temperatures and modifying of integrated circuits |
Jeanne P. Bickford, Nazmul Habib, Tad J. Wilder |
2017-04-18 |
| 9618566 |
Systems and methods to prevent incorporation of a used integrated circuit chip into a product |
Jeanne P. Bickford, Nazmul Habib, Tad J. Wilder |
2017-04-11 |
| 9576880 |
Dual damascene structure with liner |
Chih-Chao Yang |
2017-02-21 |
| 9570389 |
Interconnect structure |
Dinesh A. Badami, Wen Liu, Chih-Chao Yang |
2017-02-14 |
| 9548270 |
Electrical fuse with metal line migration |
Yan Li, Keith Kwong Hon Wong, Chih-Chao Yang |
2017-01-17 |
