| 9524883 |
Holding of interposers and other microelectronic workpieces in position during assembly and other processing |
Charles G. Woychik, Eric Tosaya |
2016-12-20 |
| 9508691 |
Flipped die stacks with multiple rows of leadframe interconnects |
Javier A. Delacruz, Belgacem Haba, Tu Tam Vu |
2016-11-29 |
| 9508638 |
Making electrical components in handle wafers of integrated circuit packages |
Liang Wang, Hong Shen |
2016-11-29 |
| 9502372 |
Wafer-level packaging using wire bond wires in place of a redistribution layer |
Tu Tam Vu, Bongsub Lee, Kyong-Mo Bang, Xuan Li, Long Huynh +4 more |
2016-11-22 |
| 9496236 |
Interconnect structure |
Debabrata Gupta, Yukio Hashimoto, Ilyas Mohammed, Laura Wills Mirkarimi |
2016-11-15 |
| 9496154 |
Use of underfill tape in microelectronic components, and microelectronic components with cavities coupled to through-substrate vias |
Eric Tosaya, Liang Wang, Cyprian Emeka Uzoh |
2016-11-15 |
| 9490195 |
Wafer-level flipped die stacks with leadframes or metal foil interconnects |
Ashok S. Prabhu, Sean MORAN |
2016-11-08 |
| 9478504 |
Microelectronic assemblies with cavities, and methods of fabrication |
Hong Shen, Liang Wang, Charles G. Woychik, Guilian Gao |
2016-10-25 |
| 9455237 |
Bowl-shaped solder structure |
Cyprian Emeka Uzoh |
2016-09-27 |
| 9437536 |
Reversed build-up substrate for 2.5D |
Liang Wang, Hong Shen, Cyprian Emeka Uzoh, Belgacem Haba |
2016-09-06 |
| 9437566 |
Conductive connections, structures with such connections, and methods of manufacture |
Cyprian Emeka Uzoh |
2016-09-06 |
| 9412806 |
Making multilayer 3D capacitors using arrays of upstanding rods or ridges |
Liang Wang, Hong Shen, Cyprian Emeka Uzoh |
2016-08-09 |
| 9412714 |
Wire bond support structure and microelectronic package including wire bonds therefrom |
Reynaldo Co, Wael Zohni, Rizza Lee Saga Cizek |
2016-08-09 |
| 9379074 |
Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects |
Cyprian Emeka Uzoh |
2016-06-28 |
| 9373585 |
Polymer member based interconnect |
Cyprian Emeka Uzoh, Charles G. Woychik, Guilian Gao, Arkalgud R. Sitaram |
2016-06-21 |
| 9368479 |
Thermal vias disposed in a substrate proximate to a well thereof |
Arkalgud R. Sitaram, Cyprian Emeka Uzoh |
2016-06-14 |
| 9355997 |
Integrated circuit assemblies with reinforcement frames, and methods of manufacture |
Laura Wills Mirkarimi, Arkalgud R. Sitaram, Charles G. Woychik |
2016-05-31 |
| 9349614 |
Device and method for localized underfill |
Liang Wang, Charles G. Woychik, Cyprian Emeka Uzoh |
2016-05-24 |
| 9331043 |
Localized sealing of interconnect structures in small gaps |
Cyprian Emeka Uzoh, Arkalgud R. Sitaram |
2016-05-03 |
| 9324626 |
Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabrication |
Hong Shen, Liang Wang |
2016-04-26 |
| 9263394 |
Multiple bond via arrays of different wire heights on a same substrate |
Cyprian Emeka Uzoh |
2016-02-16 |