Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508691 | Flipped die stacks with multiple rows of leadframe interconnects | Belgacem Haba, Tu Tam Vu, Rajesh Katkar | 2016-11-29 |
| 9461000 | Parallel signal via structure | — | 2016-10-04 |
| 9435846 | Testing of thru-silicon vias | — | 2016-09-06 |
| 9263409 | Mixed-sized pillars that are probeable and routable | — | 2016-02-16 |