Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9478504 | Microelectronic assemblies with cavities, and methods of fabrication | Hong Shen, Liang Wang, Rajesh Katkar, Charles G. Woychik | 2016-10-25 |
| 9418924 | Stacked die integrated circuit | Charles G. Woychik, Cyprian Emeka Uzoh, Ron Zhang, Daniel Buckminster | 2016-08-16 |
| 9397038 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun +1 more | 2016-07-19 |
| 9373585 | Polymer member based interconnect | Cyprian Emeka Uzoh, Rajesh Katkar, Charles G. Woychik, Arkalgud R. Sitaram | 2016-06-21 |
| 9299572 | Thermal vias disposed in a substrate without a liner layer | — | 2016-03-29 |