Issued Patents 2016
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9490222 | Wire bond wires for interference shielding | Abiola Awujoola, Wael Zohni, Ashok S. Prabhu, Willmar Subido | 2016-11-08 |
| 9484080 | High-bandwidth memory application with controlled impedance loading | Yong-Syuan Chen, Kyong-Mo Bang | 2016-11-01 |
| 9460758 | Single package dual channel memory with co-support | Richard Dewitt Crisp, Yong-Syuan Chen, Belgacem Haba, Wael Zohni | 2016-10-04 |
| 9402312 | Circuit assemblies with multiple interposer substrates, and methods of fabrication | Hong Shen, Charles G. Woychik, Arkalgud R. Sitaram | 2016-07-26 |
| 9397038 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Liang Wang +1 more | 2016-07-19 |
| 9349707 | Contact arrangements for stackable microelectronic package structures with multiple ranks | Yong-Syuan Chen, Kyong-Mo Bang | 2016-05-24 |
| 9343398 | BGA ballout partition techniques for simplified layout in motherboard with multiple power supply rail | Yong-Syuan Chen, Kyong-Mo Bang | 2016-05-17 |
| 9337170 | Contact arrangements for stackable microelectronic package structures | Yong-Syuan Chen, Kyong-Mo Bang | 2016-05-10 |
| 9281296 | Die stacking techniques in BGA memory package for small footprint CPU and memory motherboard design | Yong-Syuan Chen, Kyong-Mo Bang | 2016-03-08 |