Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502372 | Wafer-level packaging using wire bond wires in place of a redistribution layer | Rajesh Katkar, Tu Tam Vu, Bongsub Lee, Xuan Li, Long Huynh +4 more | 2016-11-22 |
| 9484080 | High-bandwidth memory application with controlled impedance loading | Zhuowen Sun, Yong-Syuan Chen | 2016-11-01 |
| 9425167 | Stackable microelectronic package structures | Belgacem Haba | 2016-08-23 |
| 9349707 | Contact arrangements for stackable microelectronic package structures with multiple ranks | Zhuowen Sun, Yong-Syuan Chen | 2016-05-24 |
| 9343398 | BGA ballout partition techniques for simplified layout in motherboard with multiple power supply rail | Yong-Syuan Chen, Zhuowen Sun | 2016-05-17 |
| 9337170 | Contact arrangements for stackable microelectronic package structures | Zhuowen Sun, Yong-Syuan Chen | 2016-05-10 |
| 9281296 | Die stacking techniques in BGA memory package for small footprint CPU and memory motherboard design | Zhuowen Sun, Yong-Syuan Chen | 2016-03-08 |