Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9490195 | Wafer-level flipped die stacks with leadframes or metal foil interconnects | Rajesh Katkar, Sean MORAN | 2016-11-08 |
| 9490222 | Wire bond wires for interference shielding | Abiola Awujoola, Zhuowen Sun, Wael Zohni, Willmar Subido | 2016-11-08 |