Issued Patents 2016
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530458 | Stub minimization using duplicate sets of signal terminals | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2016-12-27 |
| 9530749 | Coupling of side surface contacts to a circuit platform | Reynaldo Co, Willmar Subido, Hoang Linh Nguyen, Marjorie Cara, Christopher W. Lattin | 2016-12-27 |
| 9515053 | Microelectronic packaging without wirebonds to package substrate having terminals with signal assignments that mirror each other with respect to a central axis | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2016-12-06 |
| 9508629 | Memory module in a package | Belgacem Haba, Richard Dewitt Crisp, Ilyas Mohammed | 2016-11-29 |
| 9496243 | Microelectronic assembly with opposing microelectronic packages each having terminals with signal assignments that mirror each other with respect to a central axis | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2016-11-15 |
| 9490222 | Wire bond wires for interference shielding | Abiola Awujoola, Zhuowen Sun, Ashok S. Prabhu, Willmar Subido | 2016-11-08 |
| 9466587 | Multiple die in a face down package | Belgacem Haba, Richard Dewitt Crisp | 2016-10-11 |
| 9461015 | Enhanced stacked microelectronic assemblies with central contacts | Belgacem Haba, Richard Dewitt Crisp | 2016-10-04 |
| 9460758 | Single package dual channel memory with co-support | Richard Dewitt Crisp, Yong-Syuan Chen, Belgacem Haba, Zhuowen Sun | 2016-10-04 |
| 9443822 | Flip chip assembly and process with sintering material on metal bumps | — | 2016-09-13 |
| 9437579 | Multiple die face-down stacking for two or more die | Belgacem Haba, Richard Dewitt Crisp, Ilyas Mohammed, Frank Lambrecht | 2016-09-06 |
| 9423824 | Stub minimization for multi-die wirebond assemblies with parallel windows | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2016-08-23 |
| 9412714 | Wire bond support structure and microelectronic package including wire bonds therefrom | Reynaldo Co, Rizza Lee Saga Cizek, Rajesh Katkar | 2016-08-09 |
| 9377824 | Microelectronic assembly including memory packages connected to circuit panel, the memory packages having stub minimization for wirebond assemblies without windows | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2016-06-28 |
| 9373565 | Stub minimization for assemblies without wirebonds to package substrate | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2016-06-21 |
| 9368478 | Microelectronic package and method of manufacture thereof | Chung-Chuan Tseng | 2016-06-14 |
| 9368477 | Co-support circuit panel and microelectronic packages | Richard Dewitt Crisp, Belgacem Haba | 2016-06-14 |
| 9355996 | Microelectronic package with consolidated chip structures | Belgacem Haba, Richard Dewitt Crisp, Ilyas Mohammed | 2016-05-31 |
| 9318467 | Multi-die wirebond packages with elongated windows | Belgacem Haba | 2016-04-19 |
| 9312239 | Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics | Belgacem Haba, Richard Dewitt Crisp | 2016-04-12 |
| 9312244 | Multiple die stacking for two or more die | Belgacem Haba | 2016-04-12 |
| 9293444 | Co-support for XFD packaging | Richard Dewitt Crisp, Belgacem Haba | 2016-03-22 |
| 9287216 | Memory module in a package | Belgacem Haba, Richard Dewitt Crisp, Ilyas Mohammed | 2016-03-15 |
| 9287195 | Stub minimization using duplicate sets of terminals having modulo-x symmetry for wirebond assemblies without windows | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2016-03-15 |
| 9281266 | Stacked chip-on-board module with edge connector | Belgacem Haba | 2016-03-08 |