Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530749 | Coupling of side surface contacts to a circuit platform | Willmar Subido, Hoang Linh Nguyen, Marjorie Cara, Wael Zohni, Christopher W. Lattin | 2016-12-27 |
| 9508689 | Electrical connector between die pad and z-interconnect for stacked die assemblies | Jeffrey S. Leal, Suzette K. Pangrle, Scott McGrath, De Ann Eileen Melcher, Keith L. Barrie +3 more | 2016-11-29 |
| 9502390 | BVA interposer | Terrence Caskey, Ilyas Mohammed, Cyprian Emeka Uzoh, Charles G. Woychik, Michael Newman +3 more | 2016-11-22 |
| 9412714 | Wire bond support structure and microelectronic package including wire bonds therefrom | Wael Zohni, Rizza Lee Saga Cizek, Rajesh Katkar | 2016-08-09 |
| 9349706 | Method for package-on-package assembly with wire bonds to encapsulation surface | Laura Wills Mirkarimi | 2016-05-24 |
| 9252122 | Package-on-package assembly with wire bond vias | Ellis Chau, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2016-02-02 |