Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502390 | BVA interposer | Terrence Caskey, Ilyas Mohammed, Cyprian Emeka Uzoh, Charles G. Woychik, Michael Newman +3 more | 2016-11-22 |
| 9349672 | Microelectronic package | Ilyas Mohammed, Belgacem Haba, Sean Moran, Wei-Shun Wang, Christopher Wade | 2016-05-24 |
| 9252122 | Package-on-package assembly with wire bond vias | Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2016-02-02 |