Issued Patents 2016
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9524883 | Holding of interposers and other microelectronic workpieces in position during assembly and other processing | Eric Tosaya, Rajesh Katkar | 2016-12-20 |
| 9508687 | Low cost hybrid high density package | Kishor Desai, Qwai H. Low, Chok J. Chia, Huailiang Wei | 2016-11-29 |
| 9502390 | BVA interposer | Terrence Caskey, Ilyas Mohammed, Cyprian Emeka Uzoh, Michael Newman, Pezhman Monadgemi +3 more | 2016-11-22 |
| 9478504 | Microelectronic assemblies with cavities, and methods of fabrication | Hong Shen, Liang Wang, Rajesh Katkar, Guilian Gao | 2016-10-25 |
| 9433100 | Low-stress TSV design using conductive particles | Kishor Desai, Ilyas Mohammed, Terrence Caskey | 2016-08-30 |
| 9418924 | Stacked die integrated circuit | Cyprian Emeka Uzoh, Ron Zhang, Daniel Buckminster, Guilian Gao | 2016-08-16 |
| 9402312 | Circuit assemblies with multiple interposer substrates, and methods of fabrication | Hong Shen, Zhuowen Sun, Arkalgud R. Sitaram | 2016-07-26 |
| 9397038 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun, Liang Wang +1 more | 2016-07-19 |
| 9398700 | Method of forming a reliable microelectronic assembly | Cyprian Emeka Uzoh, Belgacem Haba, Michael Newman, Terrence Caskey | 2016-07-19 |
| 9379008 | Metal PVD-free conducting structures | Cyprian Emeka Uzoh, Michael Newman, Pezhman Monadgemi, Terrence Caskey | 2016-06-28 |
| 9373585 | Polymer member based interconnect | Cyprian Emeka Uzoh, Rajesh Katkar, Guilian Gao, Arkalgud R. Sitaram | 2016-06-21 |
| 9362204 | Tunable composite interposer | Cyprian Emeka Uzoh, Hiroaki Sato | 2016-06-07 |
| 9355997 | Integrated circuit assemblies with reinforcement frames, and methods of manufacture | Rajesh Katkar, Laura Wills Mirkarimi, Arkalgud R. Sitaram | 2016-05-31 |
| 9355905 | Methods and structure for carrier-less thin wafer handling | Cyprian Emeka Uzoh, Pezhman Monadgemi, Michael Newman, Terrence Caskey | 2016-05-31 |
| 9349669 | Reduced stress TSV and interposer structures | Cyprian Emeka Uzoh, Terrence Caskey, Kishor Desai, Huailiang Wei, Craig Mitchell +1 more | 2016-05-24 |
| 9349614 | Device and method for localized underfill | Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh | 2016-05-24 |
| 9252127 | Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufacture | Hong Shen, Arkalgud R. Sitaram | 2016-02-02 |
| 9237648 | Carrier-less silicon interposer | Michael Newman, Cyprian Emeka Uzoh, Pezhman Monadgemi, Terrence Caskey | 2016-01-12 |