Issued Patents 2016
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508687 | Low cost hybrid high density package | Qwai H. Low, Chok J. Chia, Charles G. Woychik, Huailiang Wei | 2016-11-29 |
| 9435965 | Single mode fiber array connector for opto-electronic transceivers | Chris Togami, Soham Pathak, Kalpendu Shastri, Bipin Dama, Vipulkumar Patel +1 more | 2016-09-06 |
| 9433100 | Low-stress TSV design using conductive particles | Charles G. Woychik, Ilyas Mohammed, Terrence Caskey | 2016-08-30 |
| 9417412 | Arrangement for placement and alignment of opto-electronic components | Kalpendu Shastri, Ravinder Kachru | 2016-08-16 |
| 9401288 | Low CTE interposer | Belgacem Haba | 2016-07-26 |
| 9349669 | Reduced stress TSV and interposer structures | Cyprian Emeka Uzoh, Charles G. Woychik, Terrence Caskey, Huailiang Wei, Craig Mitchell +1 more | 2016-05-24 |
| 9343450 | Wafer scale packaging platform for transceivers | Kalpendu Shastri, Vipulkumar Patel, Mark A. Webster, Prakash Gothoskar, Ravinder Kachru +5 more | 2016-05-17 |
| 9274290 | Coupling light from a waveguide array to single mode fiber array | Ravinder Kachru, Chris Togami | 2016-03-01 |
| 9235019 | Self-aligning optical connector assembly | Kalpendu Shastri, Soham Pathak, Utpal Kumar Chakrabarti, Vipulkumar Patel, Bipin Dama +1 more | 2016-01-12 |