Issued Patents 2016
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9385036 | Reliable packaging and interconnect structures | Cyprian Emeka Uzoh, Belgacem Haba | 2016-07-05 |
| 9368476 | Stacked microelectronic assembly with TSVs formed in stages with plural active chips | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2016-06-14 |
| 9362203 | Staged via formation from both sides of chip | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2016-06-07 |
| 9355948 | Multi-function and shielded 3D interconnects | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2016-05-31 |
| 9355901 | Non-lithographic formation of three-dimensional conductive elements | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2016-05-31 |
| 9355959 | Active chip on carrier or laminated chip having microelectronic element embedded therein | Vage Oganesian, Ilyas Mohammed, Belgacem Haba, Piyush Savalia | 2016-05-31 |
| 9349669 | Reduced stress TSV and interposer structures | Cyprian Emeka Uzoh, Charles G. Woychik, Terrence Caskey, Kishor Desai, Huailiang Wei +1 more | 2016-05-24 |
| 9287164 | Single exposure in multi-damascene process | Cyprian Emeka Uzoh, Vage Oganesian, Ilyas Mohammed, Belgacem Haba | 2016-03-15 |
| 9269692 | Stacked microelectronic assembly with TSVS formed in stages and carrier above chip | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2016-02-23 |
| 9245670 | Reliable wire method | Cyprian Emeka Uzoh | 2016-01-26 |