| 9385036 |
Reliable packaging and interconnect structures |
Cyprian Emeka Uzoh, Belgacem Haba |
2016-07-05 |
| 9368476 |
Stacked microelectronic assembly with TSVs formed in stages with plural active chips |
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia |
2016-06-14 |
| 9362203 |
Staged via formation from both sides of chip |
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia |
2016-06-07 |
| 9355948 |
Multi-function and shielded 3D interconnects |
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia |
2016-05-31 |
| 9355901 |
Non-lithographic formation of three-dimensional conductive elements |
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia |
2016-05-31 |
| 9355959 |
Active chip on carrier or laminated chip having microelectronic element embedded therein |
Vage Oganesian, Ilyas Mohammed, Belgacem Haba, Piyush Savalia |
2016-05-31 |
| 9349669 |
Reduced stress TSV and interposer structures |
Cyprian Emeka Uzoh, Charles G. Woychik, Terrence Caskey, Kishor Desai, Huailiang Wei +1 more |
2016-05-24 |
| 9287164 |
Single exposure in multi-damascene process |
Cyprian Emeka Uzoh, Vage Oganesian, Ilyas Mohammed, Belgacem Haba |
2016-03-15 |
| 9269692 |
Stacked microelectronic assembly with TSVS formed in stages and carrier above chip |
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia |
2016-02-23 |
| 9245670 |
Reliable wire method |
Cyprian Emeka Uzoh |
2016-01-26 |