Issued Patents 2016
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9484333 | Multi-chip module with stacked face-down connected dies | Belgacem Haba, Ilyas Mohammed | 2016-11-01 |
| 9455181 | Vias in porous substrates | Ilyas Mohammed, Belgacem Haba, Cyprian Emeka Uzoh | 2016-09-27 |
| 9437557 | High density three-dimensional integrated capacitors | Ilyas Mohammed, Belgacem Haba, Cyprian Emeka Uzoh, Vage Oganesian | 2016-09-06 |
| 9431475 | High density three-dimensional integrated capacitors | Vage Oganesian, Belgacem Haba, Ilyas Mohammed | 2016-08-30 |
| 9368476 | Stacked microelectronic assembly with TSVs formed in stages with plural active chips | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2016-06-14 |
| 9362203 | Staged via formation from both sides of chip | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2016-06-07 |
| 9355959 | Active chip on carrier or laminated chip having microelectronic element embedded therein | Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Belgacem Haba | 2016-05-31 |
| 9355948 | Multi-function and shielded 3D interconnects | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2016-05-31 |
| 9355901 | Non-lithographic formation of three-dimensional conductive elements | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2016-05-31 |
| 9269692 | Stacked microelectronic assembly with TSVS formed in stages and carrier above chip | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2016-02-23 |