Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508687 | Low cost hybrid high density package | Kishor Desai, Qwai H. Low, Chok J. Chia, Charles G. Woychik | 2016-11-29 |
| 9349669 | Reduced stress TSV and interposer structures | Cyprian Emeka Uzoh, Charles G. Woychik, Terrence Caskey, Kishor Desai, Craig Mitchell +1 more | 2016-05-24 |