Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502372 | Wafer-level packaging using wire bond wires in place of a redistribution layer | Rajesh Katkar, Tu Tam Vu, Bongsub Lee, Kyong-Mo Bang, Xuan Li +4 more | 2016-11-22 |
| 9496236 | Interconnect structure | Debabrata Gupta, Yukio Hashimoto, Ilyas Mohammed, Rajesh Katkar | 2016-11-15 |
| 9355997 | Integrated circuit assemblies with reinforcement frames, and methods of manufacture | Rajesh Katkar, Arkalgud R. Sitaram, Charles G. Woychik | 2016-05-31 |
| 9349706 | Method for package-on-package assembly with wire bonds to encapsulation surface | Reynaldo Co | 2016-05-24 |