Issued Patents 2016
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508638 | Making electrical components in handle wafers of integrated circuit packages | Hong Shen, Rajesh Katkar | 2016-11-29 |
| 9502347 | Microelectronic assemblies formed using metal silicide, and methods of fabrication | Hong Shen, Arkalgud R. Sitaram | 2016-11-22 |
| 9496154 | Use of underfill tape in microelectronic components, and microelectronic components with cavities coupled to through-substrate vias | Eric Tosaya, Rajesh Katkar, Cyprian Emeka Uzoh | 2016-11-15 |
| 9478504 | Microelectronic assemblies with cavities, and methods of fabrication | Hong Shen, Rajesh Katkar, Charles G. Woychik, Guilian Gao | 2016-10-25 |
| 9461196 | Non-crystalline inorganic light emitting diode | Ilyas Mohammed | 2016-10-04 |
| 9437536 | Reversed build-up substrate for 2.5D | Rajesh Katkar, Hong Shen, Cyprian Emeka Uzoh, Belgacem Haba | 2016-09-06 |
| 9412806 | Making multilayer 3D capacitors using arrays of upstanding rods or ridges | Rajesh Katkar, Hong Shen, Cyprian Emeka Uzoh | 2016-08-09 |
| 9397038 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun +1 more | 2016-07-19 |
| 9390998 | Heat spreading substrate | Ilyas Mohammed, Gabriel Z. Guevara | 2016-07-12 |
| 9356006 | Batch process fabrication of package-on-package microelectronic assemblies | Belgacem Haba, Ilyas Mohammed | 2016-05-31 |
| 9349614 | Device and method for localized underfill | Rajesh Katkar, Charles G. Woychik, Cyprian Emeka Uzoh | 2016-05-24 |
| 9348170 | Color filter substrate and display device | — | 2016-05-24 |
| 9324626 | Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabrication | Hong Shen, Rajesh Katkar | 2016-04-26 |
| 9293641 | Inverted optical device | Ilyas Mohammed, Masud Beroz | 2016-03-22 |