Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9252122 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang | 2016-02-02 |
| 9236355 | EMI shielded wafer level fan-out pop package | Jun Zhai, Mengzhi Pang, Leland W. Lew | 2016-01-12 |