Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9318474 | Thermally enhanced wafer level fan-out POP package | Jun Zhai, Yizhang Yang | 2016-04-19 |
| 9236355 | EMI shielded wafer level fan-out pop package | Jun Zhai, Se Young Yang, Leland W. Lew | 2016-01-12 |