Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9442025 | System and method for calibrating temperatures sensor for integrated circuits | Jun Zhai | 2016-09-13 |
| 9385055 | Stacked semiconductor chips with thermal management | Gamal Refai-Ahmed, Michael Z. Su, Bryan Black, Maxat Touzelbaev | 2016-07-05 |
| 9318474 | Thermally enhanced wafer level fan-out POP package | Jun Zhai, Mengzhi Pang | 2016-04-19 |
| 9263364 | Thermal interface material with support structure | Maxat Touzelbaev, Gamal Refai-Ahmed, Bryan Black | 2016-02-16 |
| 9263426 | PoP structure with electrically insulating material between packages | Jie Zhao, Jun Zhai, Chih-Ming Chung | 2016-02-16 |