Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9442025 | System and method for calibrating temperatures sensor for integrated circuits | Yizhang Yang | 2016-09-13 | $80,175,000 |
| 9331058 | Package with SoC and integrated memory | John Bruno, Timothy J. Millet | 2016-05-03 | $50,088,000 |
| 9318474 | Thermally enhanced wafer level fan-out POP package | Yizhang Yang, Mengzhi Pang | 2016-04-19 | $45,541,000 |
| 9305959 | Biometric sensor chip having distributed sensor and control circuitry | Milind S. Bhagavat | 2016-04-05 | $46,684,000 |
| 9305853 | Ultra fine pitch PoP coreless package | Jun Chung Hsu | 2016-04-05 | $46,684,000 |
| 9263426 | PoP structure with electrically insulating material between packages | Jie Zhao, Yizhang Yang, Chih-Ming Chung | 2016-02-16 | $53,133,000 |
| 9236355 | EMI shielded wafer level fan-out pop package | Mengzhi Pang, Se Young Yang, Leland W. Lew | 2016-01-12 | $83,071,000 |