Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9351409 | Method of manufacturing a thin support package structure | Hsueh-Ping Chien | 2016-05-24 |
| 9305853 | Ultra fine pitch PoP coreless package | Jun Zhai | 2016-04-05 |
JH
Jun Chung Hsu
Kinsus Interconnect Technology: 1 patents #7 of 12Top 60%
Overall (2016): #127,798 of 481,213Top 30%
2
Patents 2016