Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9449907 | Stacked semiconductor chips packaging | Lei Fu, Frank Kuechenmeister | 2016-09-20 |
| 9437561 | Semiconductor chip with redundant thru-silicon-vias | Bryan Black, Gamal Refai-Ahmed, Joe Siegel, Seth Prejean | 2016-09-06 |
| 9385055 | Stacked semiconductor chips with thermal management | Gamal Refai-Ahmed, Bryan Black, Maxat Touzelbaev, Yizhang Yang | 2016-07-05 |