Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9478489 | Semiconductor dies with reduced area consumption | Daniel Richter | 2016-10-25 |
| 9449907 | Stacked semiconductor chips packaging | Lei Fu, Michael Z. Su | 2016-09-20 |
FK
Frank Kuechenmeister
AMD: 1 patents #263 of 774Top 35%
Overall (2016): #143,447 of 481,213Top 30%
2
Patents 2016