Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496199 | Heat spreader with flexible tolerance mechanism | — | 2016-11-15 |
| 9437561 | Semiconductor chip with redundant thru-silicon-vias | Bryan Black, Michael Z. Su, Joe Siegel, Seth Prejean | 2016-09-06 |
| 9385055 | Stacked semiconductor chips with thermal management | Michael Z. Su, Bryan Black, Maxat Touzelbaev, Yizhang Yang | 2016-07-05 |
| 9263364 | Thermal interface material with support structure | Maxat Touzelbaev, Yizhang Yang, Bryan Black | 2016-02-16 |
| 9252138 | Interconnect devices for electronic packaging assemblies | David Mulford Shaddock, Arun Virupaksha Gowda, John Anthony Vogel, Christian M. Giovanniello | 2016-02-02 |