Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530749 | Coupling of side surface contacts to a circuit platform | Reynaldo Co, Hoang Linh Nguyen, Marjorie Cara, Wael Zohni, Christopher W. Lattin | 2016-12-27 |
| 9502372 | Wafer-level packaging using wire bond wires in place of a redistribution layer | Rajesh Katkar, Tu Tam Vu, Bongsub Lee, Kyong-Mo Bang, Xuan Li +4 more | 2016-11-22 |
| 9490222 | Wire bond wires for interference shielding | Abiola Awujoola, Zhuowen Sun, Wael Zohni, Ashok S. Prabhu | 2016-11-08 |