Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530690 | Metal pad structure over TSV to reduce shorting of upper metal layer | Chia-Wei Liu, Cindy Kuo, Ren-Wei Xiao | 2016-12-27 |
| 9524997 | Semiconductor device having seal ring | Zhi-Wei Zhuang, Chia-Wei Liu, Li-Hsin Chu | 2016-12-20 |
| 9368478 | Microelectronic package and method of manufacture thereof | Wael Zohni | 2016-06-14 |
| 9287303 | CMOS image sensor structure | Chiao-Chi Wang, Li-Hsin Chu, Chia-Wei Liu | 2016-03-15 |
| 9281336 | Mechanisms for forming backside illuminated image sensor device structure | Chia-Wei Liu, Li-Hsin Chu, Yu-Hsiang Tsai | 2016-03-08 |