Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530690 | Metal pad structure over TSV to reduce shorting of upper metal layer | Chung-Chuan Tseng, Chia-Wei Liu, Ren-Wei Xiao | 2016-12-27 |
CK
Cindy Kuo
Overall (2016): #433,988 of 481,213Top 95%
1
Patents 2016