Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8072076 | Bond pad structures and integrated circuit chip having the same | Shih-Hsun Hsu, Shih-Puu Jeng, Hsien-Wei Chen | 2011-12-06 |
| 8030776 | Integrated circuit with protective structure | Chen-Hua Yu, Shin-Puu Jeng, Hao-Yi Tsai, Hsien-Wei Chen, Hsiu-Ping Wei | 2011-10-04 |
| 7952167 | Scribe line layout design | Hsin-Hui Lee, Mirng-Ji Lii, Shin-Puu Jeng | 2011-05-31 |
| 7906836 | Heat spreader structures in scribe lines | Hsien-Wei Chen, Yu-Wen Liu, Jyh-Cherng Sheu, Hao-Yi Tsai, Shin-Puu Jeng +1 more | 2011-03-15 |
| 7888236 | Semiconductor device and fabrication methods thereof | Han-Ping Pu, Bai-Yao Lou, Dean Wang, Ching-Wen Hsiao, Kai-Ming Ching +3 more | 2011-02-15 |