Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8034708 | Structure and process for the formation of TSVs | Chen-Cheng Kuo, Chen-Shien Chen | 2011-10-11 |
| 8005326 | Optical clock signal distribution using through-silicon vias | Shih-Cheng Chang, Jin-Lien Lin, Kuo-Ching Hsu, Jiun Yi Wu, Yen-Huei Chen | 2011-08-23 |
| 7973413 | Through-substrate via for semiconductor device | Chen-Cheng Kuo, Chen Chen-Shien, Chih-Hua Chen | 2011-07-05 |
| 7906425 | Fluxless bumping process | Chao-Yuan Su, Chia-Fu Lin, Hsin-Hui Lee, Yen-Ming Chen, Li-Chih Chen +2 more | 2011-03-15 |
| 7888236 | Semiconductor device and fabrication methods thereof | Han-Ping Pu, Bai-Yao Lou, Dean Wang, Ching-Wen Hsiao, Chen-Cheng Kuo +3 more | 2011-02-15 |