Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8049327 | Through-silicon via with scalloped sidewalls | Chen-Cheng Kuo, Ming-Fa Chen, Chen-Shien Chen | 2011-11-01 |
| 7973413 | Through-substrate via for semiconductor device | Chen-Cheng Kuo, Chen Chen-Shien, Kai-Ming Ching | 2011-07-05 |
| 7969013 | Through silicon via with dummy structure and method for forming the same | Chen-Shien Chen, Chen-Cheng Kuo, Wen-Wei Shen | 2011-06-28 |