Issued Patents 2011
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8049327 | Through-silicon via with scalloped sidewalls | Chen-Cheng Kuo, Chih-Hua Chen, Ming-Fa Chen | 2011-11-01 |
| 8049323 | Chip holder with wafer level redistribution layer | Chao-Hsiang Yang, Jimmy Liang, Han-Liang Tseng, Mirng-Ji Lii, Tjandra Winata Karta +1 more | 2011-11-01 |
| 8034708 | Structure and process for the formation of TSVs | Chen-Cheng Kuo, Kai-Ming Ching | 2011-10-11 |
| 7969013 | Through silicon via with dummy structure and method for forming the same | Chih-Hua Chen, Chen-Cheng Kuo, Wen-Wei Shen | 2011-06-28 |
| 7956442 | Backside connection to TSVs having redistribution lines | Kuo-Ching Hsu | 2011-06-07 |
| 7928534 | Bond pad connection to redistribution lines having tapered profiles | Kuo-Ching Hsu, Hon-Lin Huang | 2011-04-19 |
| 7919406 | Structure and method for forming pillar bump structure having sidewall protection | Ming Hung Tseng, Young-Chang Lien, Chen-Cheng Kuo | 2011-04-05 |
| 7871860 | Method of semiconductor packaging | Han-Ping Pu, Tsung-Shu Lin | 2011-01-18 |