Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8049323 | Chip holder with wafer level redistribution layer | Chen-Shien Chen, Chao-Hsiang Yang, Jimmy Liang, Han-Liang Tseng, Mirng-Ji Lii +1 more | 2011-11-01 |
| 7977155 | Wafer-level flip-chip assembly methods | Chien-Hsiun Lee, Clinton Chao, Ming-Chung Sung | 2011-07-12 |
| 7863742 | Back end integrated WLCSP structure without aluminum pads | Hsiu-Mei Yu, Daniel Yang, Shih-Ming Chen, Chia-Jen Cheng | 2011-01-04 |