Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7977155 | Wafer-level flip-chip assembly methods | Chien-Hsiun Lee, Clinton Chao, Tjandra Winata Karta | 2011-07-12 |
| 7951647 | Performing die-to-wafer stacking by filling gaps between dies | Ku-Feng Yang, Wen-Chih Chiou, Weng-Jin Wu | 2011-05-31 |