Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8039315 | Thermally enhanced wafer level package | Hsin-Hui Lee, Mirng-Ji Lii | 2011-10-18 |
| 7977155 | Wafer-level flip-chip assembly methods | Clinton Chao, Ming-Chung Sung, Tjandra Winata Karta | 2011-07-12 |