Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8039315 | Thermally enhanced wafer level package | Mirng-Ji Lii, Chien-Hsiun Lee | 2011-10-18 |
| 7952167 | Scribe line layout design | Mirng-Ji Lii, Shin-Puu Jeng, Shang-Yun Hou | 2011-05-31 |
| 7906425 | Fluxless bumping process | Chao-Yuan Su, Chia-Fu Lin, Yen-Ming Chen, Kai-Ming Ching, Li-Chih Chen +2 more | 2011-03-15 |